Images of what is purportedly the upcoming Apple iPhone 7 recently surfaced on Twitter. If the photos are true, the flagship handset may be thinner than ever and feature several powerful specifications.
Based on the leaked images on Twitter, the Apple iPhone 7 will have a slimmer design and a sliding physical QWERTY keyboard at the bottom. Users can opt to use the physical keyboard or onscreen keyboard to write messages and keep notes. The Home button is still present at the bottom.
An HSBC research note suggested that TSMC will most likely handle the full order of A10 chips for Apple, which will be used for the iPhone 7. The integrated fan out packaging will allow a stack of chips to be placed on top of each other and directly to the motherboard, which will minimize the vertical height from the board, and ultimately creating a thinner smartphone.
Forbes predicted that there will be at least two variants of the new flagship model – the iPhone 7 and iPhone 7s. The new handset will most likely have a new processor, called the A10 and faster LPDDR4 memory to complement the graphics engine. One version of the iPhone 7 will have a 4.7-inch screen with 2GB of RAM, while the 5.5-inch version will have 3GB of RAM. There may also be improvements in RF content to support greater cellular speeds, as provided by more advanced cellular baseband processors. The phone will probably feature the Qualcomm X12 LTE modem and new connectivity chips from Broadcom to boost Wi-Fi performance.
Ming-Chi Kuo, a KGI Securities analyst, speculated that the Apple iPhone 7 will have a thickness of 6 to 6.5mm, which is a cut from the 7.1-mm iPhone 6s and 7.3-mm iPhone 6s Plus.
Fool.com reported that the display resolution will most likely be improved. The 4.7-inch model will feature a 1920 x 1080 screen with 468ppi. The 5.5-inch model will have a display resolution of 2560 x 1440 with 534ppi. There may also be enhancements in black levels/contrast ratio and color accuracy and quality. The iPhone 7 may have a 12-megapixsel main camera with improvements in image quality. Optical image stabilization may be added as well. The new model may also introduce multi-3d Touch capability.
There is also the possibility that the 3.5mm headphone jack will be dropped, and substituted by a Lightning port, which take care of audio signals, as well as allow more space to make the iPhone 7 thinner.
More updates and details on the iPhone 7 are expected soon.
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